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About TMTS
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Exhibitor
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Visitor
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Press
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Travel
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- About TMTS
- Exhibitor
- Visitor
- Press
- Travel
At TMTS 2026, leading machine tool manufacturer Tongtai Machine & Tool Co., Ltd.
(4526.TW) is showcasing a comprehensive layout from equipment processing
to cloud-based Digital Twins. Tongtai is presenting high-efficiency processing
solutions for semiconductor Silicon Carbide (SiC) and demonstrating its
cross-platform integration through the Tongtai
AI Agent, which connects the NVIDIA
Omniverse platform with third-party software. Furthermore, a strategic
alliance with Yeong Chin Machinery
(YCM) highlights a unified ecosystem booth, strengthening Taiwan's
strategic position in the global supply chain.
Connecting Ecosystems with AI Agents A core highlight is the synchronization of physical production lines with the digital world. Using NVIDIA Omniverse, Tongtai has constructed a precise Digital Twin environment. While the physical line operates at the show, the virtual environment performs simultaneous data simulation for real-time monitoring and "future capacity prediction." Through the Tongtai AI Agent, visitors can use natural language to interact with Tongtai’s Line Management System (TLM), ITRI identification tools, and FANUC simulation software, significantly shortening the decision-making chain.
Semiconductor
Focus: VU-5 Ultrasonic Machining for SiC
Addressing the extreme hardness and brittleness of SiC, Tongtai presents the VU-5 Ultrasonic Assisted Machining Center.
High-frequency vibrations significantly reduce processing resistance, enabling
precise and rapid drilling while improving yield rates. This is integrated into
a one-stop automated solution featuring Autonomous Mobile Robots (AMR) and
metallographic inspection tools.
Tongtai-YCM Alliance: Strategic Synergy Tongtai stated that the alliance with YCM is based on complementary core technologies and market channels. As core members of TMBA, both companies aim to drive industry standardization and provide competitive "Value-Based Ecosystem" services globally. Visit booth F0112 at TICEC to experience these digital empowerment solutions.
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