Theme
Digital Transformation
Green Transformation
PRECISION MOTION INDUSTRIES, INC.
Product Description :
Achieved the high-precision motions, lifting, rotaty, as well as quick grip motion in confined spaces.
Features
•High Positioning Accuracy
•Lightweight and Compact
•Simple Installation
•Support Bearing
•Smooth Motion and Lower Noise
Application
SCARA robot, Assembly robot, Automatic loader, and Machining center's, ATC equipment.
SAFEWAY MACHINERY INDUSTRY CORPORATION
Product Description :
Clamping system : Air+Mechanical power +M code
Suitable for Robot for automation
Can be connected to any machines ( I/O cable )
Built-in solenoid valve-24V
Type of socket and cables must be provided by customer
Standard cable length : 2 meters ( optional )
INNOSERV FA INC. TAICHUNG BRANCH
Product Description :
Micro Dynamics Vertical Machining Center Line opens a new era in multi-purpose and versatile machining centers. Compact, durable, powerful, strong and accurate, the MEGA/TERA Series starts a revolution in the market: the smallest C-frame machines provide powerful and precise results for manufacturers of dies and molds, aerospace, automotive, semi-conductor, job shops and general machine sectors.
The MEGA/TERA Series has been designed with the latest in technology being utilized throughout the machine with productivity in mind. From its EtherNet/IP architecture for easy automation and integration into systems and cells, to its Motion Control for fast and smooth operations used in all industries, the MEGA/TERA Series has quickly become one of the industries leading machine tool lines of Vertical Machining Centers.
The MEGA/TERA Series has been refined through years of research and development of new technologies that greatly enhance the machines for the rigors of the Mold and Die industry.
All series are equipped with
■ 15,000 rpm Built-In Spindle
■ Thermal Compensation (DYPEC)
■ Micro Dynamics HMI
MENG YI INDUSTRIAL CO., LTD.
Product Description :
The dimension of Drill with Inner-outer Chamfer Tool is from Ø3.0 to Ø25.0. Drilling and chamfering are process on the machine once. The material of drill is tungsten carbide and it could be customized. Replaceable insert could be sharpened.
Video: https://youtu.be/kTbYR3u_lfo
HO CHEN MACHINERY & ELECTRIC IND. CO., LTD.
Product Description :
X axis travel:
Single movement: 1125 mm (44" )inch
Dual movement: 560 mm (22") inch
YZ axis travel 700x500 mm (28"x20") inch
Work table: 1850x850 mm (73"x33") inch
Max. Workpiece: 2800x1400x700 mm (110"x55"x28") inch
Max. Workpiece weight: 5800 kg
Max. electrode weight: 400 kg
Machine net weight:8350 kg
Oil level: 110-550 mm (4"-22") inch
Packing size(LxWxH): 5430x4600x3090 mm (214"x181"x122") inch
Work Table to platen: 700-1200 mm (28"-47") inch
Filter： 4
Paper filter：8
Capacity：3400 Liters
Machine Features
> Windows CE controller
> A dialog window with picture description.
> Special repaired frames to quicken the maintenance speed.
> Close-loop design of digital feedback on three axes of the machine significantly increases positioning precision and ORBIT-CUT machining accuracy and efficiency.
> Simple operation interface.
> Common function keys are located on the operational panel for direct use.
> Hot key setting.
> ATC (automatic tool change) and C-axis 360° index can be installed; the process of coarse machining to ultra-fine machining can be completed at one time.
> Dialogue diagram provides various hole-expanding modes such as quick search of edge, centers and datum marks.
> Rich color graphic (the same resolution as a PC screen).
> Automatic multi-step machining (coarse, medium coarse, medium fine, fine, superfine)—up to 10 steps.
> Unlimited number of machining conditions can be saved as machining archives. Each set of machining conditions can be edited, modified or stored. They are easy to edit and easy to find.
> Automatic origin search and multi-point coordinate memory capability.
> 1/2 design capability, ARC automatic discharge waveform detection and automatic adjustment.
> Automatic center position detection, automatic compensation, search of hole center and deepest point; fixed hole machining (cyclic mode, independent mode), which is suitable for different machining conditions; Radial, circular, square, linear (vector), coning, 45° hole-expanding machining.
> Three-axis beeline, two-axis arc, three-axis helix.
> Chinese/English versions interface, metric/British system switch and Z-axis quick up, quick down, slow up and slow down capability.
> Lateral machining, three axes, six directions (plane rotation).
> All alarms describe the source, date and exact time of problem occurrence.
> Optical scale is applied for close-loop position control, enabling extreme position for machining.
> Automatic editing—settings can be done according to type of material, work piece size, machining depth, one side die clearance, final current and rate of electrode wear.
> CNC models possess conventional capability of consistent level of energy discharge, achieving stable and rapid machining and smooth high quality on machining surface while the rate of electrode wear is still low.
> Monitor page indicates machining path and orbital pattern in use.
MING HUNQ MACHINERY CO., LTD.
Product Description :
GD-100 is a device that can serve your need for grinding and chamfering of sheet metal. Such as flame cutting, laser cutting, punching of the residue and bristles after stamping. All of the sharp angle of the edges and inner holes can easily be done on this machine.
Taiwan Laser Application Development Association (TLADA)
Product Description :
Established by law, non-profit social organization, that with the government to promote production
Industrial upgrading, and promote industrial upgrading professional laser application technology of energy produced by the Council and,
Government, and academia to exchange, establishment of industrial development consensus and dialogue with the government of the pipeline. "
Simultaneously through various international exchanges, and actively explore business opportunities, boost the global competitiveness of Chinese enterprises, the development phase for the case with the world。
TAIWAN ASAHI DIAMOND INDUSTRIAL CO., LTD.
Product Description :
* Processing Method｜Grinding
* Applications｜Semiconductor Material Processing
* Silicon wafer edge grinding wheels require strict shape precision and wear resistance, and require stable grinding capabilities, so metal bond grinding wheels can be used. We can provide single groove or multi groove, integrated coarse and fine grinding wheel according to customer’s requirements.
* Processing Material | Silicon Crystal
