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HIWIN TECHNOLOGIES CORPORATION
製品の説明 :
The key components in Wafer Robot, such as ballscrew and direct drive motor, are manufactured by HIWIN, with Hiwin-developed software, HIWIN has the advantages of vertical integration of hardware and software. HIWIN Wafer Robot integrates the high-precision, high-rigidity direct drive motor with repeatability of ±0.1mm, small rotating radius and high space utilization. HIWIN can provide customized service according to production requirements and enhance customer competitiveness. Applicable to the semiconductor industry (wafer pick and place), optoelectronic industry (small panel, small solar panels), LED industry (sapphire substrate, rubber ring) and other pick and place equipment.
USYNC INC.
製品の説明 :
"VM25" is a high-performance application of a fully modular system designed for grinding machines, including automatic balancing on the 1 and 2 sides of the grinding wheel spindle, the use of audio detection to control the contact of the grinding wheel to the workpiece or sand, online Measurement and off-line measurement (absolute or relative) and other functions.
"B-Safe" can provide vibration and temperature information of the main shaft to detect and monitor the status analysis of the main shaft and machine. It is a new thinking product for intelligent monitoring. Its miniaturized volume design helps to install directly on the main shaft, ensuring that it can provide immediate monitoring of abnormal operating conditions, further predicting the timing of maintenance and failures, protecting your machine and reducing downtime.
