Theme
Digital Transformation
Green Transformation
USYNC INC.
Product Description :
"VM25" is a high-performance application of a fully modular system designed for grinding machines, including automatic balancing on the 1 and 2 sides of the grinding wheel spindle, the use of audio detection to control the contact of the grinding wheel to the workpiece or sand, online Measurement and off-line measurement (absolute or relative) and other functions.
"B-Safe" can provide vibration and temperature information of the main shaft to detect and monitor the status analysis of the main shaft and machine. It is a new thinking product for intelligent monitoring. Its miniaturized volume design helps to install directly on the main shaft, ensuring that it can provide immediate monitoring of abnormal operating conditions, further predicting the timing of maintenance and failures, protecting your machine and reducing downtime.
HIWIN TECHNOLOGIES CORPORATION
Product Description :
HIWIN Articulated Robot is the most widely used robot in automation with high accuracy, high flexibility with multi degrees of freedom and wide working range which can be used in pick and place, stacking, high precision assembly or complex machining. They are suitable for automated production to replace manual repetitive tasks, like pick and place, stacking, de-burring, grinding and assembly. The key components are developed and manufactured by HIWIN, which reduces costs and provides high value and solutions strengthening the competitiveness on the global market for our customers.
HIWIN TECHNOLOGIES CORPORATION
Product Description :
The key components in Wafer Robot, such as ballscrew and direct drive motor, are manufactured by HIWIN, with Hiwin-developed software, HIWIN has the advantages of vertical integration of hardware and software. HIWIN Wafer Robot integrates the high-precision, high-rigidity direct drive motor with repeatability of ±0.1mm, small rotating radius and high space utilization. HIWIN can provide customized service according to production requirements and enhance customer competitiveness. Applicable to the semiconductor industry (wafer pick and place), optoelectronic industry (small panel, small solar panels), LED industry (sapphire substrate, rubber ring) and other pick and place equipment.
