Theme
Digital Transformation
Green Transformation
Industrial Technology Research Institute
Main Product :
"Non-Contact Laser Wafer Inspection Equipment", and "High-Precision Online/Offlin Laser Thickness Gauge System" It has the benefits of non-contact, instant monitoring, continuous measuring, and no radiation damage. The measurable materials include non-transparent materials such as metal, non-metal, wafer, resin, plastic film, and fiber. The products have been applied to the production lines.
3D MILLING
Main Product :
Chou & Hsieh Co., Ltd. is looking for partners in other countries to distribute Solid Carbide Cutting Tools we manufactured under our own brand. Send us your request for quote, we will reply with our program and offer.
Our Products:
# 3DMILLING Solid Carbide Endmills
# 3DMILLING Milling Cutters & Solid Carbide Indexable Inserts
# 3DMILLING Abrasive Filament Brushes for Deburring
