Product Description :
Features: High rigidity, high rotational accuracy, high geometric quality
Compatible with market standard products, short delivery time
The perfect solution for high positioning accuracy requirements:
Rotary tables and indexing plates, integrated processing machines, Milling machines, drilling machines, Machining Center
Product Description :
* Processing Method|Grinding
* Applications|Semiconductor Material Processing
* Silicon wafer edge grinding wheels require strict shape precision and wear resistance, and require stable grinding capabilities, so metal bond grinding wheels can be used. We can provide single groove or multi groove, integrated coarse and fine grinding wheel according to customer’s requirements.
* Processing Material | Silicon Crystal
Product Description :
FUL series CNC Lathe is to enhance high speed and high accuracy. 45 degree slant bed construction features high rigidity and high stability.
X、Z axis are mounted with ball type linear guide ways or box guide ways. Axis movement is directly driven by a servo motor , allowing the high rapid traverse rates on X、Z axis.